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Liquid Epoxy Resin

Solid Epoxy Resin

Polyamide Epoxy Resin

Epoxy Floor Hardener

Novolac Epoxy Resin

Hydrogenated Bisphenol A Epoxy Resin

Phenalkamine Epoxy Hardener

Cycloaliphatic Amine Hardener

Epoxy Resin Additives

Epoxy Curing Accelerator

Epoxy Resin Adhesive

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Polyamide Epoxy Resin

Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230

Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230

Polyetheramine Hot Melt Electronic Adhesive Glue Sealing Curing Agent D-230

Brand Name:	HONREPOXY
Model Number:	D230
MOQ:	5 tấn
Price:	USD4.4-5.3/kg

Detail Information

Product Description

Detail Information

Nguồn gốc:

Trung Quốc

Vật liệu:

Polyetheramine

Vẻ bề ngoài:

Chất lỏng trong suốt nhẹ

Giá trị amin (mgKOH/g):

440~480

AHEW (Khối lượng tương đương amin hydro), g/eq:

40

chi tiết đóng gói:

200kg trong thùng sắt

Khả năng cung cấp:

3000 tấn mỗi tháng

Làm nổi bật:

Polyetheramine electronic adhesive glue

,

Hot Melt electronic adhesive glue

,

D-230 adhesive glue for electronics

Product Description

Polyamide hot melt adhesive electronic sealing glue curing agent D-230 countertype C301 D-230 is characterized by repeating oxypropylene units in the backbone. It is a difunctional, primary amine with an average molecular weight of about 230. 1.The physical and chemical properties Color, Pt-Co

Tags:

Liquid Low Viscosity Epoxy Resin

Transparent Epoxy Hardener Resin

Cost-Effective Polyamide Epoxy Resin

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